Description:

The H5AN8G4NCJR-*xxC, H5AN8G8NCJR-*xxC, H5AN8G6NCJR-*xxC is a 8Gb CMOS Double Data Rate IV(DDR4) Synchronous DRAM, ideally suited for the main memory applications which requires large memorydensity and high bandwidth. SK hynix 8Gb DDR4 SDRAMs offer fully synchronous operations referenced toboth rising and falling edges of the clock. While all addresses and control inputs are latched on the risingedges of the CK (falling edges of the CK), Data, Data strobes and Write data masks inputs are sampled onboth rising and falling edges of it. The data paths are internally pipelined and 8-bit prefetched to achievevery high bandwidth.

FEATURES:

• VDD=VDDQ=1.2V +/- 0.06V

• Fully differential clock inputs (CK, CK) operation

• Differential Data Strobe (DQS, DQS)

• On chip DLL align DQ, DQS and DQS transition with CK transition

• DM masks write data-in at the both rising and falling edges of the data strobe

• All addresses and control inputs except data, datastrobes and data masks latched on the rising edges ofthe clock

• Programmable CAS latency 9, 10, 11, 12, 13, 14, 15,16, 17, 18, 19 and 20 supported

• Programmable additive latency 0, CL-1, and CL-2 supported (x4/x8 only)

• Programmable CAS Write latency (CWL) = 9, 10, 11,12, 14, 16, 18

• Programmable burst length 4/8 with both nibble sequential and interleave mode

• BL switch on the fly

• 16banks

• Average Refresh Cycle (Tcase of 0 oC~ 95 oC)- 7.8 µs at 0oC ~ 85 oC- 3.9 µs at 85oC ~ 95 oC

• JEDEC standard 78ball FBGA(x4/x8), 78ball FBGA(x16)

• Driver strength selected by MRS

• Dynamic On Die Termination supported

• Two Termination States such as RTT_PARK andRTT_NOM switchable by ODT pin

• Asynchronous RESET pin supported 

• ZQ calibration supported

• TDQS (Termination Data Strobe) supported (x8 only)

• Write Levelization supported

• 8 bit pre-fetch

• This product in compliance with the RoHS directive.

• Internal Vref DQ level generation is available

• Write CRC is supported at all speed grades

• Maximum Power Saving Mode is supported

• TCAR(Temperature Controlled Auto Refresh) mode issupported

• LP ASR(Low Power Auto Self Refresh) mode is supported

• Fine Granularity Refresh is supported

• Per DRAM Addressability is supported

• Geardown Mode(1/2 rate, 1/4 rate) is supported

• Programable Preamble for read and write is supported

• Self Refresh Abort is supported

• CA parity (Command/Address Parity) mode is supported

• Bank Grouping is applied, and CAS to CAS latency(tCCD_L, tCCD_S) for the banks in the same or differentbank group accesses are available

• DBI(Data Bus Inversion) is supported(x8)

• This product consist of a half chip of 8Gb die

• A15 address pin is fixed as Low or High

• Support X8 mode only

• tRFC2min and tRFC4min have longer spec value thannormal 4Gb die (Table12)