Features：

· Open NAND Flash Interface (ONFI) 1.0-compliant1

- Single-level cell (SLC) technology

- Page size x8: 2112 bytes (2048 + 64 bytes)

- Page size x16: 1056 words (1024 + 32 words)

- Block size: 64 pages (128K + 4K bytes)

- Plane size: 2 planes x 2048 blocks per plane

- Device size: 4Gb: 4096 blocks; 8Gb: 8192 blocks

- 16Gb: 16,384 blocks

· Asynchronous I/O performance

- RC/WC:20ns (3.3V),25ns (1.8V)

- Array performance

- Read page: 25us 3

- Program page: 200us (TYP: 1.8V, 3.3V)3

- Erase block: 700us (TYP)

- Command set: ONFI NAND Flash Protocol

- Advanced command set

- Program page cache mode4

- Read page cache mode 4

- One-time programmable (OTP) mode

- Two-plane commands 4

- Interleaved die (LUN) operations

- Read unique IDBlocklock (1.8V only)

- Internal data move

Operation status byte provides software method fordetecting

- Operation completion

- Pass/fail condition

- Write-protect status

Ready/Busy# (R/B#) signal provides a hardware method of detecting operation completion

WP# signal: Write protect entire device

First block (block address 00h) is valid when ship-ped from factory with ECC. For minimum requiredECC, see Error Management.

Block 0 requires 1-bit ECC if PROGRAM/ERASE cycles are less than 1000

RESET (FFh) required as first command after power-on

Alternate method of device initialization (Nand_In-it) after power up (contact factory)

Internal data move operations supported within the plane from which data is read

Quality and reliability

- Data retention: 10 years

- Endurance: 100,000 PROGRAM/ERASE cycles

 Operating voltage range

- Vcc:2.7-3.6V

- Vcc:1.7-1.95V

Operating temperature:

- Commercial: 0°C to +70°C

- Industrial (IT):-40°C to +85°C

- Automotive Industrial (AIT): -40°C to +85°C

- Automotive (AAT): -40°C to +105°C

Package

- 48-pin TSOP type 1, CPL2

- 63-ballVFBGA