Description:

The ISM330DHCX is a system-in-package featuring a high-performance 3D digitalaccelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.ST’s family of MEMS sensor modules leverages the robust and maturemanufacturing processes already used for the production of micromachinedaccelerometers and gyroscopes.The various sensing elements are manufactured using specialized micromachiningprocesses, while the IC interfaces are developed using CMOS technology that allowsthe design of a dedicated circuit which is trimmed to better match the characteristicsof the sensing element.

Features:

• 3D accelerometer with selectable full scale: ±2/±4/±8/±16 g

• 3D gyroscope with extended selectable full scale:±125/±250/±500/±1000/±2000/±4000 dps

• Extended temperature range from -40 to +105 °C

• Embedded compensation for high stability over temperature

• SPI/I²C serial interface

• Auxiliary SPI serial interface for data output of gyroscope and accelerometer(OIS and other stabilization applications)

• Six-channel synchronized output

• Sensor hub feature to efficiently collect data from additional external sensors

• Embedded smart FIFO up to 9 kbytes

• Programmable Finite State Machine to process data from accelerometer,gyroscope, and external sensors

• Machine Learning Core

• Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4Dorientation, click and double-click

• Embedded pedometer, step detector and counter for healthcare applications

• Analog supply voltage: 1.71 V to 3.6 V

• Embedded temperature sensor

• Embedded self-test both for gyroscope and accelerometer

• High shock survivability• ECOPACK, RoHS and “Green” compliant

Applications:

• Industrial IoT and connected devices

• Antennas, platforms, and optical image and lens stabilization

• Robotics, drones and industrial automation

• Navigation systems and telematics

• Vibration monitoring and compensation