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TDK InvenSense ICM-40608

The TDK InvenSense ICM-40608 is a high-performance 6-axis MotionTracking device that integrates a 3-axis gyroscope and a 3-axis accelerometer into a compact 2.5 mm × 3 mm × 0.91 mm 14-pin LGA package. It features a 2K-byte FIFO that reduces serial bus traffic and system power consumption by enabling burst reads of sensor data. The gyroscope offers eight programmable full-scale ranges from ±15.625 dps to ±2000 dps, while the accelerometer supports four ranges from ±2 g to ±16 g. Additional features include on-chip 16-bit ADCs, programmable digital filters, an embedded temperature sensor, and programmable interrupts. The device supports both I2C (up to 1 MHz) and SPI (up to 24 MHz) serial interfaces, with a VDD and VDDIO operating range of 1.71 V to 3.6 V. Manufactured using InvenSense's patented CMOS-MEMS wafer-level bonding platform, the ICM-40608 ensures high robustness with 20,000g shock reliability.

PRODUCT OVERVIEW:

The ICM-40608 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, and a 3-axis accelerometer in a small 2.5x3x0.91mm (14-pin LGA) package. It also features a 2K-byte FIFO that can lower the traffic on the serial bus interface, and reduce powerconsumption by allowing the system processor to burst read sensor data and then go into a low-power mode. ICM-40608, with its6-axis integration, enables manufacturers to eliminate the costly and complex selection, qualification, and system level integrationof discrete devices, guaranteeing optimal motion performance for consumers.

The gyroscope supports eight independently programmable full-scale range settings from ±15.625dps to ±2000dps, and theaccelerometer supports four independently programmable full-scale range settings from ±2g to ±16g.

Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, an embedded temperature sensor, andprogrammable interrupts. The device features I2C and SPI serial interfaces, a VDD operating range of 1.71 V to 3.6 V, and a separateVDDIO operating range of 1.71V to 3.6V.

The host interface can be configured to support I2C slave or SPI slave modes. The I2C interface supports speeds up to 1 MHz, and theSPI interface supports speeds up to 24 MHz.

By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with companionCMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of2.5x3x0.91 mm (14-pin LGA), to provide a very small yet high performance low cost package. The device provides high robustness bysupporting 20,000g shock reliability.

APPLICATIONS:

• Smartphones and Tablets

• Head Mounted Displays

• Wearable Sensors


How to Order

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