Description:

C2000™ real-time microcontrollers are optimized for processing, sensing, and actuation to enhance the closed-loop performance in real-time control applications such as industrial motor drives; photovoltaic inverters and digital power; electric vehicles and transportation; motor control; and sensing and signal processing. The C2000 family comprises high-performance and entry-performance MCUs. The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices are highly integrated, high-performance solutions for demanding control applications. Throughout this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234, and F28232, respectively. A summary of the features for each device is provided in the F2833x Device Comparison and F2823x Device Comparison.

Features:

• High-Performance Static CMOS Technology

– Up to 150 MHz (6.67-ns Cycle Time)

– 1.9-V/1.8-V Core, 3.3-V I/O Design

• High-Performance 32-Bit CPU (TMS320C28x)

– IEEE 754 Single-Precision Floating-Point Unit (FPU) (F2833x only)

– 16 × 16 and 32 × 32 MAC Operations

– 16 × 16 Dual MAC

– Harvard Bus Architecture

– Fast Interrupt Response and Processing

– Unified Memory Programming Model

– Efficient Code (Using C/C++ and Assembly Language)

• 6-Channel DMA Controller (For ADC, McBSP, ePWM, XINTF, and SARAM)

• 16-Bit or 32-Bit External Interface (XINTF)

– Over 2M × 16 Address Reach

• On-Chip Memory

– F28335, F28333, F28235: 256K × 16 Flash, 34K × 16 SARAM

– F28334, F28234: 128K × 16 Flash, 34K × 16 SARAM

– F28332, F28232: 64K × 16 Flash, 26K × 16 SARAM

– 1K × 16 OTP ROM

• Boot ROM (8K × 16)

– With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)

– Standard Math Tables

• Clock and System Control

– On-Chip Oscillator

– Watchdog Timer Module

• GPIO0 to GPIO63 Pins Can Be Connected to One of Eight External Core Interrupts

• Peripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts

• 128-Bit Security Key/Lock

– Protects Flash/OTP/RAM Blocks

– Prevents Firmware Reverse Engineering

• Enhanced Control Peripherals

– Up to 18 PWM Outputs

– Up to 6 HRPWM Outputs with 150-ps MEP Resolution

– Up to 6 Event Capture Inputs

– Up to 2 Quadrature Encoder Interfaces

– Up to 8 32-Bit Timers (6 for eCAP, 2 for eQEP)

– Up to 9 16-Bit Timers (6 for ePWM, 3 for XINTCTR)

• Three 32-Bit CPU Timers

• Serial Port Peripherals

– Up to 2 CAN Modules

– Up to 3 SCI (UART) Modules

– Up to 2 McBSP Modules (Configurable as SPI)

– One SPI Module

– One Inter-Integrated Circuit (I2C) Bus

• 12-Bit ADC, 16 Channels

– 80-ns Conversion Rate

– 2 × 8 Channel Input Multiplexer

– Two Sample-and-Hold

– Single/Simultaneous Conversions

– Internal or External Reference

• Up to 88 Individually Programmable, Multiplexed GPIO Pins with Input Filtering

• JTAG Boundary Scan Support

– IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary-Scan Architecture

• Advanced Debugging Features

– Analysis and Breakpoint Functions

– Real-Time Debug via Hardware

• Development Support Includes

– ANSI C/C++ Compiler/Assembler/Linker

– Code Composer Studio™ IDE

– DSP/BIOS™ and SYS/BIOS

– Digital Motor Control and Digital Power Software Libraries

• Low-Power Modes for Power Savings

– Support for IDLE, STANDBY, HALT Modes

– Disable Individual Peripheral Clocks

• Endianness: Little Endian

• Package Options:

– Lead-Free, Green Packaging

– 176-Ball Plastic Ball Grid Array (BGA) [ZJZ]

– 179-Ball MicroStar BGA™ [ZHH]

– 179-Ball New Fine-Pitch Ball Grid Array (nFBGA) [ZAY]

– 176-Pin Low-Profile Quad Flatpack (LQFP) [PGF]

– 176-Pin Heat-Spreader Low-Profile Quad Flatpack (HLQFP) [PTP]

• Temperature Options:

– A: –40°C to 85°C (PGF, ZHH, ZAY, ZJZ)

– S: –40°C to 125°C (PTP, ZJZ)

– Q: –40°C to 125°C (PTP, ZJZ) (AEC Q100 Qualified for Automotive Applications)

Applications:

• Advanced Driver Assistance Systems (ADAS)

– Medium/Short-Range Radar

• Building Automation

– HVAC Motor Control

– Traction Inverter Motor Control

• Factory Automation and Control

– Automatic Sorting Equipment

– CNC Control

• Grid Infrastructure

– Central Inverters

– String Inverters

• Hybrid, Electric, and Powertrain Systems

– Inverter and Motor Control

– On-Board Charger (OBC) and Wireless Charger

• Motor Drives

– AC Input BLDC Motor Drives

– Servo Drive Control Module

• Power Delivery

– Industrial AC/DC Power Supplies